4 Layers Blind & Buried Vias PCB for Communication Applications

In communication applications, blind and buried vias are widely designed according to circuit performance. Due to complexity, communication board has multilayers, generally 6-12 layers. To reduce dist

  • Layer(s): 4
  • Material: FR-4
  • Copper Weight: 1.0oz
  • Laminate Thickness: 2.0mm
  • Surface Finish: ENIG
  • Solder Mask Color: Green
  • Min. Trace: 3mil
  • Min. Hole Size: 3mil
  • Silkscreen Color: White
  • Min. Spacing: 3mil
  • Max. Panel Size: 510mm x 615mm
  • Application: Industrial Control
  • Package: Vacuum package|Carton
  • Lead Time: 10-15 days

In communication applications, blind and buried vias are widely designed according to circuit performance. Due to complexity, communication board has multilayers, generally 6-12 layers. To reduce disturbance of high frequency signals such as 2.4G, PCB designers usually take blind and buried vias to connect middle layers. PCBBox has great experiences to make blind and buried vias PCB for communication applications. Our advanced equipments, refined workflow and internal management system ensure the high quality fabrication.