Multilayer ENIG PCB with Top/Bottom BGA Pads

  • Layer(s): 8
  • Material: FR-4
  • Copper Weight: 1.5oz
  • Laminate Thickness: 2.0mm
  • Surface Finish: ENIG
  • Solder Mask Color: Black
  • Min. Trace: 3mil
  • Min. Hole Size: 3mil
  • Silkscreen Color: White
  • Min. Spacing: 3mil
  • Max. Panel Size: 510mm x 615mm
  • Application: Industrial Control
  • Package: Vacuum package
  • Lead Time: 7-10 days