SMT Assembly

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SMT Assembly Services

Surface mount technology (SMT) assembly is a process for attaching electronic components directly to the surface of a printed circuit board (PCB). The components used in this process are called surface mount devices (SMDs). SMT assembly has several advantages over the through-hole method of PCB manufacturing, including:

  • Cost

    SMT requires fewer holes to be drilled into the circuit board, which lowers manufacturing costs.

  • Efficiency

    SMT uses circuit board space more efficiently and is faster.

  • Automation

    SMT allows for automated production, which improves quality and reduces cost.
SMT Assembly Services
01005 Chip & 0.25mm pitch BGA

SMT Assembly Services

The SMT assembly process typically involves the following steps:

  • Stencil printing

    A stencil printer aligns the stencil with the SMT pads on the board and prints solder paste onto the board.

  • Pick and place

    A machine uses nozzles to place components onto the board.

  • Reflow soldering

    The PCB is sent into a reflow oven to solder the components and solder paste. The reflow process typically involves ramp-up, pre-heat/soak, reflow at peak temperature, and cooling.

  • X-ray inspection

    If BGA is placed on the PCB, an X-ray is used to scan for defects in the solder balls.